SPIE Advanced Lithography / 2021 Digital Forum

Invited

1. DSA process optimization for high volume manufacturing
2. Atomic Level Control of Pattern Fidelity During SAC Etch
3. Key Challenges and Solutions in Forthcoming Device Scaling

Oral presentation

1. Exploring nano-scale effects of selective spin-on polymer deposition
2. Self-aligned double pattern process using DSA pattern
3. Fundamental study of polymer dynamic behavior in resist processing
4. Novel Bottom-Up Organic Mandrel Growth to Enable Organic Mandrel EUV SADP for sub-5nm Node Technologies
5. LER Reduction Strategies for 20nm Pitch EUV Self-Aligned Double Patterning (SADP) with Self-Aligned Block (SAB) Formation
6. Advanced multiple patterning technologies for high density hexagonal hole arrays

Poster: rescheduled from 2/22 to 2/24

1. Novel Processing Technologies for Advanced EUV Patterning Materials
2. EUV defect reduction activities using coater/developer and etching technique
3. Enabling EUV pattern transfer by optimized under layer