Process | PI, Package, SOD, OCCF, etc. | EUV, Immersion, ArF, KrF, i-line, SOC | Immersion, ArF, KrF, i-line, SOC | Immersion, ArF, KrF, i-line, SOC | Immersion, ArF, KrF, i-line |
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Additional features | Flexible configuration for multiple application, High reliability & productivity based on LITHIUS Pro™ Z system | High productivity & process performance, Low particle wafer transfer system, OEE improvement, Reduced cost of chemicals | High productivity, High throughput with small footprint, OEE improvement, Flexible configuration for double patterning process | High throughput with small footprint, OEE* improvement, Reduced cost of chemicals | Metrology integration, Data analysis "Ingenio", Immersion process capability |
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